4,4'-Methylenebis(N,N-diglycidylaniline) YLSE-721/721C/721L

YLSE-721 is a tetrafunctional epoxy resin. It is designed for fabricating high-temperature performance composites by the filament winding process. This system exhibits long pot life at process temperatures, yielding systems with high glass transition temperatures and excellent retention of mechanical performance, even at elevated temperatures.

PNE type phenolic epoxy resin YLEP-638 is a multifunctional epoxy resin synthesized by the condensation of a phenol-formaldehyde novolac resin with epichlorohydrin. Its structure is characterized by multiple functional groups and high cross-linking density. This results in performance properties that include excellent heat resistance, chemical resistance, and high mechanical strength. Consequently, it is primarily used in applications demanding high temperature stability, chemical resistance, and superior mechanical strength.

PNE type phenolic epoxy resin YLEP-631 is a multifunctional epoxy resin synthesized by the condensation of a phenol-formaldehyde novolac resin with epichlorohydrin. Its structure is characterized by multiple functional groups and high cross-linking density. This results in performance properties that include excellent heat resistance, chemical resistance, and high mechanical strength. Consequently, it is primarily used in applications demanding high temperature stability, chemical resistance, and superior mechanical strength.

As DOPO can react with various groups such as epoxy, double bond, carbonyl, halogen and amino group to prepare DOPO epoxy resin as a starting material, which is highly effective in flame retardancy and less likely to produce toxic gases, and is regarded as one of the most probable alternatives to halogen-containing flame retardants in the future.

Bisphenol A epoxy resin, chemical name bisphenol A diglycidyl ether, is made by the reaction of bisphenol A and epichlorohydrin under alkaline conditions. Bisphenol A epoxy resin is the largest production of epoxy resins, but also one of the most widely used varieties. Because of its good physical and mechanical properties, chemical resistance and electrical insulation properties, epoxy resin is widely used in coatings, adhesives, glass fibre reinforced plastic, laminates, electronic casting, potting, encapsulation and other fields.

Bisphenol F epoxy resin, also known as bisphenol F diglycidyl ether, referred to as BPF, is prepared by the reaction of phenol and formaldehyde under acid catalysis to produce bisphenol F, and then with epichlorohydrin in the presence of sodium hydroxide polycondensation reaction. This is a new type of epoxy resin developed in order to reduce the viscosity of bisphenol A epoxy resin itself and have the same properties. It is usually a liquid bisphenol F epoxy resin obtained by the reaction of bisphenol F (diphenol methane) and epichlorohydrin under the action of NaOH.

Bisphenol A epoxy resin, chemical name bisphenol A diglycidyl ether, is made by the reaction of bisphenol A and epichlorohydrin under alkaline conditions. Bisphenol A epoxy resin is the largest production of epoxy resins, but also one of the most widely used varieties. Because of its good physical and mechanical properties, chemical resistance and electrical insulation properties, epoxy resin is widely used in coatings, adhesives, glass fibre reinforced plastic, laminates, electronic casting, potting, encapsulation and other fields.

Phenolic epoxy resin is made by the reaction of linear phenolic resin and epichlorohydrin in the presence of NaOH. Commonly used phenolic epoxy resins are PNE type phenolic epoxy resin, BNE type phenolic epoxy resin, CNE type phenolic epoxy resin. Phenolic epoxy resins are widely used in the fields of machinery and electronics, aerospace, transport, construction and so on because of their excellent process performance, mechanical properties and physical properties.

Brominated epoxy resin, BE or BEO for short, is an epoxy resin with self-extinguishing function containing elemental bromine (Br) in the molecular structure.

MDI modified epoxy resin is an isocyanate modified epoxy resin. The soft cyanate ester structure is accessed into the epoxy resin structure, greatly improving the flexibility of the epoxy resin. This type of epoxy resin has very good flexibility and improves the disadvantage that epoxy resin is brittle after curing.

Macromolecular epoxy resin is a modified bisphenol A/F epoxy resin, containing a smooth molecular skeleton and long molecular chain segments, with excellent flexibility and powder bonding force. The resin is commonly used in epoxy resin systems to increase flexibility, improve bonding and adhesion, and improve resin flow.

Dicyclopentadienyl phenol-based epoxy resins are abbreviated as DCPD epoxy resin. The reaction of dicyclopentadiene with phenol can produce DCPD-phenol resin, and further reaction with epichlorohydrin can obtain DCPD-phenol epoxy resin.

Multifunctional epoxy resins are a class of epoxy resins with trifunctionality or tetrafunctionality, which not only have the excellent properties of traditional epoxy resins, but also have more functional groups, such as light group, amine group, and hydrophobic amine group. These functional groups can react with other compounds to form more chemical bonds, so that the multifunctional epoxy resin has higher cross-linking density and better heat resistance, chemical resistance, wear resistance and other properties.

AFG-90M, chemical name 3-Glycidyloxy-N,N-diglycidylaniline, CAS 71604-74-5,YLSE-0600

4,5-Epoxytetrahydrophthalic Acid Diglycidylester YLSE-186, CAS 25293-64-5

Bisphenol A epoxy resin, chemical name bisphenol A diglycidyl ether, is made by the reaction of bisphenol A and epichlorohydrin under alkaline conditions. Bisphenol A epoxy resin is the largest production of epoxy resins, but also one of the most widely used varieties. Because of its good physical and mechanical properties, chemical resistance and electrical insulation properties, epoxy resin is widely used in coatings, adhesives, glass fibre reinforced plastic, laminates, electronic casting, potting, encapsulation and other fields.

Bisphenol F epoxy resin, also known as bisphenol F diglycidyl ether, referred to as BPF, is prepared by the reaction of phenol and formaldehyde under acid catalysis to produce bisphenol F, and then with epichlorohydrin in the presence of sodium hydroxide polycondensation reaction. This is a new type of epoxy resin developed in order to reduce the viscosity of bisphenol A epoxy resin itself and have the same properties. It is usually a liquid bisphenol F epoxy resin obtained by the reaction of bisphenol F (diphenol methane) and epichlorohydrin under the action of NaOH.

Phenolic epoxy resin is made by the reaction of linear phenolic resin and epichlorohydrin in the presence of NaOH. Commonly used phenolic epoxy resins are PNE type phenolic epoxy resin, BNE type phenolic epoxy resin, CNE type phenolic epoxy resin. Phenolic epoxy resins are widely used in the fields of machinery and electronics, aerospace, transport, construction and so on because of their excellent process performance, mechanical properties and physical properties.

Brominated epoxy resin, BE or BEO for short, is an epoxy resin with self-extinguishing function containing elemental bromine (Br) in the molecular structure.

As DOPO can react with various groups such as epoxy, double bond, carbonyl, halogen and amino group to prepare DOPO epoxy resin as a starting material, which is highly effective in flame retardancy and less likely to produce toxic gases, and is regarded as one of the most probable alternatives to halogen-containing flame retardants in the future.

MDI modified epoxy resin is an isocyanate modified epoxy resin. The soft cyanate ester structure is accessed into the epoxy resin structure, greatly improving the flexibility of the epoxy resin. This type of epoxy resin has very good flexibility and improves the disadvantage that epoxy resin is brittle after curing.

Dicyclopentadienyl phenol-based epoxy resins are abbreviated as DCPD epoxy resin. The reaction of dicyclopentadiene with phenol can produce DCPD-phenol resin, and further reaction with epichlorohydrin can obtain DCPD-phenol epoxy resin.

Multifunctional epoxy resins are a class of epoxy resins with trifunctionality or tetrafunctionality, which not only have the excellent properties of traditional epoxy resins, but also have more functional groups, such as light group, amine group, and hydrophobic amine group. These functional groups can react with other compounds to form more chemical bonds, so that the multifunctional epoxy resin has higher cross-linking density and better heat resistance, chemical resistance, wear resistance and other properties.

Our crystalline epoxy resin mainly includes Biphenyl phenolic epoxy resin and BHQ biphenyl crystalline epoxy resin and Tetramethyl bisphenol epoxy resin.

Hydrogenated bisphenol A epoxy resin，HBPA epoxy resin for short, has the performance of general-purpose epoxy resin, and due to the benzene ring transformed into a saturated six-membered ring, to overcome the unsaturated double bond fracture defects. The resin cured material has good weather resistance, corona resistance, leakage trace resistance, dielectric strength and other characteristics.

Phenolic resin is a phenolic compound (phenol, cresol, nonylphenol, arylalkyl phenol, cashew phenol, octyl phenol, bisphenol A, dimethylphenol, or a mixture of several phenols) and aldehydes (formaldehyde, acetaldehyde, furfural, or a mixture of several aldehydes) through the addition and polycondensation reaction and a large class of synthetic resins.

As DOPO can react with various groups such as epoxy, double bond, carbonyl, halogen and amino group to prepare DOPO epoxy resin as a starting material, which is highly effective in flame retardancy and less likely to produce toxic gases, and is regarded as one of the most probable alternatives to halogen-containing flame retardants in the future.

3.4-EPOXYCYCLOHEXYLMETHYL 3.4-EPOXYCYCLOHEXANE CARBOXYLATE; 3,4-epoxycyclohexanecarboxylicacid(3,4-epoxycyclohexylmethyl)ester YLCE-2021 CAS 2386-87-0