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Dicyclopentadienyl phenol-based epoxy resins are abbreviated as DCPD epoxy resin. The reaction of dicyclopentadiene with phenol can produce DCPD-phenol resin, and further reaction with epichlorohydrin can obtain DCPD-phenol epoxy resin.
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DCPD epoxy resin is a class of epoxy resins with a special skeleton structure. Its molecular structure contains a benzene ring, as well as the alicyclic structure of dicyclopentadiene. Epoxy resins of this type of structure have Low Dk/Df, excellent heat resistance, low hygroscopicity, low elasticity and high adhesion sealing properties.
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| Grade No. | EEW (g/eq) |
Softening point (°C) |
Hy-Cl (ppm) |
|
| YLDC-267 | 260-275 | 53-60 | <300 | |
| YLDC-267S | 265-275 | 60-70 | <300 | |
| YLDC-270 | 260-280 | 70-80 | <300 | |
| YLDC-270S | 260-280 | 80-90 | <300 | |
| YLDC-275 | 265-285 | 90-100 | <300 | |
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Copper-clad laminates
Electronic packaging materials
Molding materials
Flame-retardant coatings
Flame-retardant adhesives
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Store in well-ventilated area. Keep away from flames and direct sunlight. Close the cap tightly immediately after use.
All safety information is provided in the Material Safety Data Sheet.
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At least 12 months from the date of manufacture in the original packing in ambient temperatures.
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Drum package.
