In the process of industrial flooring construction, the selection, storage and custody of materials is an important link to ensure the quality of the project and improve the construction efficiency. If the high quality construction materials are not properly stored and kept, their performance will be greatly reduced, and even affect the service life of the whole floor. In this paper, we will discuss in detail the industrial flooring construction of the material storage and storage points, to help ensure that the project is carried out smoothly.   The importance of material storage In the construction of industrial flooring, the material is the foundation of the floor. Whether it is wear-resistant aggregate, epoxy resin, hardener or other auxiliary materials, their performance and quality are directly related to the overall effect of the floor. Therefore, the storage and custody of materials are particularly important. Reasonable storage can ensure stable material performance, avoid moisture, deterioration, pollution and other problems, so as to ensure the quality of construction.   The main points of material storage and custody Classification storage Different types of flooring materials should be classified and stored to avoid confusion and cross-contamination. For example, wear-resistant aggregate should be stored in a dry, ventilated warehouse to avoid moisture; epoxy resin and hardener should be stored in a cool, dry place to avoid direct sunlight and high temperature. Clear labelling Each material storage area should be set up with obvious signage, indicating the name, specification, quantity, production date and other information of the material. This helps construction workers to quickly find the required materials and improve construction efficiency. Moisture and humidity prevention     Most of the flooring materials are in the form of powder, liquid or paste, which are easily deteriorated by moisture. Therefore, attention should be paid to moisture and humidity in the storage process. You can use laying moisture-proof mats, use sealed containers and other methods to reduce humidity. Fire and explosion prevention Some flooring materials belong to flammable and explosive items, such as epoxy resin and hardener. In the storage process, we should strictly abide by the fire and explosion prevention regulations, set up a special storage area, equipped with fire extinguishers and other fire fighting facilities. Regular Inspection Regular inspection of the stored materials to ensure stable quality, no damage, no expiration date. For the discovery of problems in the material to be dealt with in a timely manner, to avoid the use of substandard materials lead to engineering quality problems   The precautions for material storage Keep clean Material storage area should be kept clean to avoid dust, oil and other contaminated materials. At the same time, construction workers should also pay attention to keep their hands clean when taking materials, to avoid bringing pollutants into the material. Avoid direct sunlight Direct sunlight can cause some flooring materials performance decline, and even trigger chemical reactions. Therefore, avoid direct sunlight in the storage process, you can use sunshade net, curtains and other measures to shield. Temperature control The storage temperature of the flooring material has an important impact on its performance. The temperature range should be controlled during the storage process to avoid too high or too low temperature leading to material deterioration. For materials that require special temperature conditions, set up special temperature control equipment. Compliance In the process of material storage should strictly comply with the relevant regulations and operating procedures to ensure the safety and stability of the material. For the violation of the provisions of the act should be timely stopped and corrected.   In the construction of industrial flooring, the storage and custody of materials is to ensure the quality of the project and improve the construction efficiency of the key links. Only by doing a good job of storing and keeping the materials can we give full play to the performance advantages of the materials and create a high-quality, durable industrial flooring. I hope this article can provide you with some useful reference and inspiration.   Nanjing Yolatech provides all kinds of high purity and low chlorine epoxy resins, including Bisphenol A epoxy resin, Bisphenol F epoxy resin, Phenolic epoxy resin, Brominated epoxy resin, DOPO modified phenolic epoxy resin, MDI modified epoxy resin, DCPD epoxy resin, Multifunctional epoxy resin, Crystalline epoxy resin, HBPA epoxy resin and so on. And we also could provide all kinds of curing agents or hardeners and diluents.       We will be at your service 24 hours a day. Pls contact us freely.  

Benzyl Alcohol Definition   Benzyl Alcohol abbreviated as BA, a highly soluble, colourless, low viscosity liquid. Also known as benzyl alcohol. Benzyl alcohol is the simplest fatty alcohol containing phenyl, and may be regarded as hydroxymethyl-substituted benzene, or phenyl-substituted methanol. It is a colourless transparent viscous liquid with a faint aromatic odour, polar, low toxicity and low vapour pressure, hence its use as an alcohol solvent. It is flammable. Slightly soluble in water (4 g/100 mL), miscible with ethanol, ether, benzene chloroform and other organic solvents.   Benzyl Alcohol Uses   Benzyl alcohol is an excellent solvent with medium boiling point, mainly used in: Epoxy resin diluent, curing agent, solvent, plasticizer; epoxy coatings; pharmaceutical synthesis and solvent, preservative of ointment or liquid; photographic developer, welding mouth cleaner, solvent for plexiglass, lens tinting agent; meat and food printing oil and ball-point pen oil solvents, solvents for printing inks; aroma fixing agent, jasmine, incense, ylang ylang, etc., fragrance blending is an indispensable spice. It can also be used to formulate soap and daily-use cosmetics.   Advantages of benzyl alcohol for epoxy diluent   Epoxy resin curing agent 1,3-BAC, AEP, IPDA, D-230 and other modification of the necessary solvents The material itself is non-toxic (can be used for human injection reagents) High boiling point, non-volatile, and after curing due to the strong polarity of benzyl alcohol, can be very good with the epoxy resin, will not migrate phenomenon Benzyl alcohol can promote the reaction of epoxy resin and amine, speed up the reaction speed; benzyl alcohol has a very good hydrophobicity, can be used in epoxy diluents Benzyl alcohol has good hydrophobic properties, can significantly improve the gloss of the coating, reduce the phenomenon of whitening Benzyl alcohol can improve the toughness of the cured material   Benzyl alcohol as epoxy resin diluent application fields Benzyl alcohol can be applied to epoxy flooring, epoxy potting, epoxy solvent-free coatings, epoxy trim adhesive, amine curing agent modification and so on.   Typical data of benzyl alcohol Appearance: colourless transparent liquid Refractive index: 1.538-1.541   Matters to be noted in the use of Benzyl Alcohol Benzyl Alcohol needs to be stored away from light, otherwise it will turn yellow and other phenomena It can only be used in epoxy resin/amine curing system, especially not in epoxy resin/anhydride system; To control the amount of addition, because the addition of benzyl alcohol will reduce the mechanical properties of the cured material, solvent resistance and chemical resistance, so it is necessary to determine the proportion of addition according to the actual requirements, in addition, benzyl alcohol can significantly improve the curing speed, so this point needs to be taken into account. Benzyl alcohol is used as a diluent by many manufacturers in practical applications, especially for diluting the curing agent.   Nanjing Yolatech provides all kinds of high purity and low chlorine epoxy resins, including Bisphenol A epoxy resin, Bisphenol F epoxy resin, Phenolic epoxy resin, Brominated epoxy resin, DOPO modified phenolic epoxy resin, MDI modified epoxy resin, DCPD epoxy resin, Multifunctional epoxy resin, Crystalline epoxy resin, HBPA epoxy resin and so on. And we also could provide all kinds of curing agents or hardeners and diluents.       We will be at your service 24 hours a day. Pls contact us freely.    

If the epoxy resin glue curing speed is too fast, generally can be resolved by the following methods   Adjust the amount of mixing at one time: If the glue is cured at room temperature, too much glue at one time will lead to accelerated curing due to exothermic too fast, so that you can reduce the amount of mixing glue. change to slow curing agent: this is a common method to solve the problem of epoxy resin curing too fast. Slow curing agent is designed for fast curing epoxy resin, can slow down the curing time, so that the epoxy resin has enough time for full reaction. Reduce the ambient temperature during curing: the curing speed of epoxy resin adhesive is related to the ambient temperature, the higher the temperature, the faster the curing speed. Therefore, reduce the ambient temperature can slow down the curing speed. You can reduce the ambient temperature by controlling the room temperature or using cooling equipment during the curing process. Add curing retarder: Retarder is an additive that can slow down the curing speed of epoxy resin adhesive.   Nanjing Yolatech provides all kinds of high purity and low chlorine epoxy resins, including Bisphenol A epoxy resin, Bisphenol F epoxy resin, Phenolic epoxy resin, Brominated epoxy resin, DOPO modified phenolic epoxy resin, MDI modified epoxy resin, DCPD epoxy resin, Multifunctional epoxy resin, Crystalline epoxy resin, HBPA epoxy resin and so on. And we also could provide all kinds of curing agents or hardeners and diluents.     We will be at your service 24 hours a day. Pls contact us freely.  

  Epoxy mortar is generally formulated by epoxy resin, curing agent and add appropriate proportion of cement, quartz sand and other fillers. After curing to meet certain physical and mechanical properties. Can be widely used in road and bridge, water conservancy engineering, waterproofing engineering and other building defects repair and used as seepage leakage materials.   The role of epoxy mortar repair repair anti-seepage and leakage decoration.   Features of epoxy mortar   Epoxy resin itself has good adhesion and bonding, strong mechanical properties, good resistance to acid and alkali and salt spray performance, low curing shrinkage and other advantages, a variety of materials such as concrete has a strong adhesion, with room-temperature curing agent, the appropriate cement, quartz sand and other fillers made of mortar, this mortar has high strength, good adhesion, corrosion, waterproofing, and can be completed curing in a humid environment. It has the advantages of high strength, good adhesion, anti-corrosion, waterproof, and can be cured in wet environment.   The main components of epoxy mortar composition   1.Ordinary bisphenol A type epoxy resin YL-128 Epoxy Equivalent (g/eq): 184 ~ 190 Viscosity (cps/25℃): 12000 ~ 15000 Product Description: General standard bisphenol A epoxy resin.  YL-127 Epoxy Equivalent (g/eq): 176 ~ 184 Viscosity (cps/25℃): 8000 ~ 11000 Product Description: Low-viscosity standard bisphenol A epoxy resin.   2.Curing agent Curing agent can be selected from aliphatic primary amine cured at room temperature. Polyamide Viscosity (75°C/mPa s): 3100-3700 Amine value (mgKOH/g): 240-260 Characteristics and applications: High viscosity polyamides for reactive adhesives, solvent based coatings. Viscosity (75°C/mPa s): 700-900 Amine value (mgKOH/g): 340-370 Characteristics and applications: medium-viscosity polyamide for reactive adhesives, solvent-borne coatings, mortars Viscosity (25°C/mPa s): 700-2000 Amine value (mgKOH/g): 250-290 Characteristics and applications: Used in high solids coatings, very excellent adhesion on wet surfaces   Diethylenetriamine Diethylenetriamine is a typical representative of vinylamine. Abbreviation: DETA Molecular formula: H2N(C2H4NH)2H Approximate molecular weight: ~103 Active hydrogen equivalent: ~20.6 Reaction with epoxy resin Theoretical dosage: 8~11 parts   3.Filler Weakly alkaline or neutral hard powder and granule can be used. Powder can choose quartz powder, silicon powder, cement, etc.; granular material can choose quartz sand, hard river sand, etc.   Typical applications of epoxy mortar: Used as concrete structure repair and repair. Such as high-speed roads, water conservancy projects, bridges, culverts, tunnels and other building defects repair and reinforcement. Used as tile, marble, granite bonding material. Used for steel structure and concrete bonding. Such as steel adhesive. Used in chemical industry, petroleum, marine industry, wharf and other concrete structure of anti-corrosion protection and repair. Used for underground pipelines, hydroelectric power stations, dams and other buildings sealing anticorrosion and waterproof seepage treatment. Used as landscape decoration. Such as landscape walkway paving materials, wear-resistant flooring.   Nanjing Yolatech provides all kinds of high purity and low chlorine epoxy resins, including Bisphenol A epoxy resin, Bisphenol F epoxy resin, Phenolic epoxy resin, Brominated epoxy resin, DOPO modified phenolic epoxy resin, MDI modified epoxy resin, DCPD epoxy resin, Multifunctional epoxy resin, Crystalline epoxy resin, HBPA epoxy resin and so on. And we also could provide all kinds of curing agents or hardeners and diluents.     We will be at your service 24 hours a day. Pls contact us freely.  

Methylcyclohexylenediamine (HTDA) is a kind of alicyclic amine monomer with side methyl group, it is a new type of alicyclic amine epoxy resin curing agent, Cas No:13897-55-7. It can be used as curing agent alone, or mixed with other common epoxy curing agents (e.g. aliphatic amine, alicyclic amine, aromatic amine, acid anhydride, etc.) or general-purpose accelerators (e.g. tertiary amine, imidazole), to cure epoxy resins in a wide range of temperatures, applicable to composites, coatings, adhesives, flooring and other fields, can be used in the organic synthesis of polyamides, polyimides and other polyurethanes; it can be used in polyurethane to do the amine chain expander, and to form urea with the isocyanate group, which is the main component of the urea chain. It can be used in polyurethane as amine chain extender to form urea bond with isocyanate group and improve the comprehensive performance of the product.   Product characteristics Unique application period without loss of mechanical strength Very low viscosity, easy to mix with other curing agents Low active hydrogen equivalent, small additive ratio Very low vapour pressure Moderate curing speed for improved handling in composites, adhesives and flooring applications   References                       Appearance (25°C): colourless or yellowish transparent liquid Colour: ≤1 Viscosity(mPa.s/25°C): 5-15 Amine value (mgKOH/g): 850-900 Active hydrogen equivalent (g/ep): 32 Purity(%): ≥99.5 Water content(%):≤0.2 Boiling point(℃):213 Specific gravity(g/mm³):0.94 Additive amount: 16-17   Nanjing Yolatech provides all kinds of high purity and low chlorine epoxy resins, including Bisphenol A epoxy resin, Bisphenol F epoxy resin, Phenolic epoxy resin, Brominated epoxy resin, DOPO modified phenolic epoxy resin, MDI modified epoxy resin, DCPD epoxy resin, Multifunctional epoxy resin, Crystalline epoxy resin, HBPA epoxy resin and so on. And we also could provide all kinds of curing agents or hardeners and diluents.   We will be at your service 24 hours a day. Pls contact us freely.    

Electronic encapsulation adhesive is used to encapsulate electronic devices, is to play a sealing, encapsulation or potting of a class of electronic glue or adhesive. After the electronic encapsulation adhesive package can play the role of waterproof, moistureproof, shockproof, dustproof, anti-corrosion, heat dissipation, confidentiality. Therefore, electronic packaging adhesive needs to have high and low temperature resistance, high dielectric strength, good insulation, environmental protection and safety features.   Why choose epoxy resin? With the continuous development of large-scale integrated circuits and the miniaturisation of electronic components, the heat dissipation of electronic components has become a key issue affecting their service life, and there is an urgent need for high thermal conductivity adhesives with good heat dissipation properties as encapsulation materials. Epoxy resin has excellent heat resistance, electrical insulation, adhesion, dielectric properties, mechanical properties and small shrinkage, chemical resistance, add curing agent and have better processing and operability. Several kinds of special epoxy resin introduction   Biphenyl epoxy resin Tetramethylbiphenyl epoxy resin synthesised by two-step method is cured by DDM and DDS, showing high heat resistance, good mechanical properties and low water absorption.   Silicone-containing epoxy resin Another research hotspot in the field of electronic encapsulation is the introduction of organosilicon chain segments, which can not only improve heat resistance, but also enhance the toughness of the epoxy after curing, and silicone-containing polymers have good flame retardant properties, the low surface energy of silicone-containing groups cause them to migrate to the surface of the resin to form a heat-resistant protective layer, thus avoiding further thermal degradation of the polymer.   Fluorine-containing epoxy resin Fluorine-containing polymers have many unique properties, the fluorine element has the largest electronegativity, the force between the electron and the nucleus is large, the bonding energy of the chemical bond with other atoms is large, the refractive index is low, and the fluorine-containing polymers are excellent in heat resistance, oxidation resistance, and resistance to pharmaceutical properties.  Fluorine-containing epoxy resin with dust self-cleaning, heat, wear, corrosion and other properties and also improve the solubility of epoxy resin, at the same time, has excellent flame retardant, become a new material in the field of electronic packaging.   Dicyclopentadiene-containing epoxy resin Dicyclopentadiene-o-cresol resin can be synthesized by Friedel-Crafts reaction. The resin is cured with methyl hexahydrophthalic anhydride and polyamide 651 curing agent, and the Tg of the cured material is 141°C and 168°C, respectively, which is about 20°C higher than that of the simple E51 cured resin.   Naphthalene-containing epoxy resin A new naphthalene-containing structural phenolic epoxy resin has been synthesised. Its DDS cured product shows excellent heat resistance, Tg is 262°C, 5% heat loss is 376°C.   Alicyclic epoxy resin Alicyclic epoxy resins are characterised by high purity, low viscosity, good workability, high heat resistance, low shrinkage, stable electrical properties and good weathering, etc. They are particularly suitable for high-performance electronic encapsulation materials with low viscosity, high heat resistance, low water absorption and excellent electrical properties, and are highly promising electronic encapsulation materials.   Hybrid modified epoxy resin Blending is an important method to effectively improve material properties. In a kind of epoxy matrix, mixed with another kind of epoxy resin or several kinds of epoxy resin, so that the matrix material of a particular kind of performance or several kinds of specific performance improvement, so as to obtain the comprehensive performance of the new material is more excellent. In epoxy moulding plastics, through the blending can achieve the goal of cost reduction, improve the use of performance and processing performance.   Nanjing Yolatech provides all kinds of high purity and low chlorine epoxy resins, including Bisphenol A epoxy resin, Bisphenol F epoxy resin, Phenolic epoxy resin, Brominated epoxy resin, DOPO modified phenolic epoxy resin, MDI modified epoxy resin, DCPD epoxy resin, Multifunctional epoxy resin, Crystalline epoxy resin, HBPA epoxy resin and so on. And we also could provide all kinds of curing agents or hardeners and diluents.     We will be at your service 24 hours a day. Pls contact us freely.

Polyetheramines are part of the Yolatech product family. They generally contain a primary amine group attached to one end of the polyether backbone. The polyether backbone is typically composed of propylene oxide (PO), ethylene oxide (EO) or a PO/EO blend. This is why they are called "polyether amines". Epoxy resins react with polyether amines in a typical amine reaction, and polyether amines give excellent elasticity, toughness and low colouration to the cured product. Polyetheramine's low viscosity and proper workability time facilitates the production of epoxy resin adhesives.   Polyetheramine T-5000 polyetheramine is a trifunctional primary amine with an average molecular weight of about 5000. It is a clarified, nearly colourless, viscous liquid.   Polyetheramine T-5000 Typical Physical and Chemical Data Appearance: colourless to light yellow Colour phase (Pt-Co): 75 Max. Active hydrogen equivalent (g/eq): ~952 Viscosity (25°C, cst): 819   Pros Light colour Increases peel strength in epoxy adhesives Increases toughness   Applications Crosslinking agent for polyurea Auxiliary curing agent for epoxy systems where adhesion and flexibility are required Surfactants and corrosion inhibitors   Nanjing Yolatech provides all kinds of high purity and low chlorine epoxy resins, including Bisphenol A epoxy resin, Bisphenol F epoxy resin, Phenolic epoxy resin, Brominated epoxy resin, DOPO modified phenolic epoxy resin, MDI modified epoxy resin, DCPD epoxy resin, Multifunctional epoxy resin, Crystalline epoxy resin, HBPA epoxy resin and so on. And we also could provide all kinds of curing agents or hardeners and diluents.   We will be at your service 24 hours a day. Pls contact us freely.  

Epoxy resin adhesive is a widely used chemical grouting materials, epoxy resin adhesive with high strength, good adhesive force, low curing shrinkage, in line with a variety of process needs, can meet the needs of concrete crack repair. Epoxy resin and polyamide as the main film-forming substances, compound diluent, accelerator, etc. made of glue, according to the gap, supplemented by atmospheric pressure or high pressure grouting method will be injected into the cracks, so as to achieve adhesion, reinforcing, seepage and other repair effects. Here we introduce two commonly used epoxy resin products, used in concrete reinforcement, with good adhesive strength, levelling performance and excellent mechanical properties.   YL-128 Epoxy equivalent (g/eq): 184 ~ 190 Viscosity (cps/25℃): 12000 ~ 15000 Product Description: Standard bisphenol A epoxy resin for general use.   YL-127 Epoxy equivalent (g/eq): 176 ~ 184 Viscosity (cps/25℃): 8000 ~ 11000 Product Description: Low viscosity standard bisphenol A epoxy resin.   Nanjing Yolatech provides all kinds of high purity and low chlorine epoxy resins, including Bisphenol A epoxy resin, Bisphenol F epoxy resin, Phenolic epoxy resin, Brominated epoxy resin, DOPO modified phenolic epoxy resin, MDI modified epoxy resin, DCPD epoxy resin, Multifunctional epoxy resin, Crystalline epoxy resin, HBPA epoxy resin and so on. And we also could provide all kinds of curing agents or hardeners and diluents. We will be at your service 24 hours a day. Pls contact us freely.

1,3-cyclohexanedimethylamine CAS No.579-20-6,short for 1,3-BAC,is used as a raw material for epoxy resin curing agents in a wide range of applications around the world. 1,3-BAC, as an alicyclic amine, has excellent hardness, weathering, and chemical resistance, a refined appearance, and a faster cure rate.   Typical Physical and Chemical Data Appearance: Colourless transparent liquid Colour (G):1.0 Max Viscosity (mPa.s/20℃): 9.1 Active hydrogen equivalent(g/eq): 35.6   Advantages of 1,3-BAC as an epoxy resin curing agent Excellent UV resistance and transparency Fast curing speed Excellent curing at high temperatures & high humidity Low active hydrogen equivalents, low additions Low solidification point Good curing even at low temperatures.   Application of 1,3-BAC      In jewellery adhesive 1,3-BAC's excellent resistance to yellowing provides a long-lasting guarantee for the glossy appearance of the jewellery adhesive. 1,3-BAC provides hardness guarantee for jewellery. 1,3-BAC lower addition faster curing speed to improve the overall cost-effective advantage.      In seam sealer Improve the curing speed, 1,3-BAC can fully guarantee the curing time. 1,3-BAC low colour, high transparency to fully guarantee the appearance of the product colour. 1,3-BAC provides the required hardness and strength to the product.     In composite materials 1,3-BAC low active hydrogen equivalent, low additive quantity can bring higher cost-effective advantage for products. 1,3-BAC high hardness, to provide assurance for the strength of the product. 1,3-BAC good chemical resistance, to ensure that the product's lasting use.     In laminating adhesive 1,3-BAC's excellent resistance to yellowing provides assurance of long-lasting colour stability of the cured product. 1,3-BAC's excellent colour transparency ensures the transparent and clear quality of the product. The low viscosity of 1,3-BAC ensures good workability.   1,3-BAC (1,3-cyclohexanedimethylamine) is now widely used as epoxy resin curing agent in coatings, adhesives, composites, etc. 1,3-BAC is one of the amines with less additive quantity at present, and its excellent product appearance and performance make it have an outstanding cost-effective advantage.   Nanjing Yolatech provides all kinds of high purity and low chlorine epoxy resins, including Bisphenol A epoxy resin, Bisphenol F epoxy resin, Phenolic epoxy resin, Brominated epoxy resin, DOPO modified phenolic epoxy resin, MDI modified epoxy resin, DCPD epoxy resin, Multifunctional epoxy resin, Crystalline epoxy resin, HBPA epoxy resin and so on. And we also could provide all kinds of epoxy resin curing agents or hardeners and diluents.   We will be at your service 24 hours a day. Pls contact us freely.  

Epoxy terrazzo flooring is produced using epoxy resin and curing agents as binders, supplemented with various decorative aggregates, and manufactured through special processes. Epoxy terrazzo flooring can be widely applied in large-scale shopping malls, high-end commercial buildings, luxury clubs, exhibition halls, hotel lobbies, as well as residential and villa floor decorations. Epoxy terrazzo flooring features moisture resistance, slip resistance, waterproofing, dust prevention, and durability. Polyetheramine products used as curing agents in epoxy terrazzo flooring Polyetheramine D-230 Polyetheramine D-230 is a bifunctional amine with an average molecular weight of about 230. Features: Low viscosity, low color, low volatility Fully miscible with various solvents, including water The cured product is tough, clear, and has excellent impact resistance, suitable for coatings, casting, adhesives, etc. The coating surface does not exhibit common whitening phenomena associated with the use of other amine curing agents Typical Data: Appearance: Colorless and transparent Average active hydrogen equivalent (g/eq): ~60 Color (Pt-Co): ~25 Viscosity (cst, 25℃): ~9.5                                                                                                                                                          Nanjing Yolatech provides all kinds of high purity and low chlorine epoxy resins, including Bisphenol A epoxy resin, Bisphenol F epoxy resin, Phenolic epoxy resin, Brominated epoxy resin, DOPO modified phenolic epoxy resin, MDI modified epoxy resin, DCPD epoxy resin, Multifunctional epoxy resin, Crystalline epoxy resin, HBPA epoxy resin and so on. And we also could provide all kinds of curing agents or hardeners and diluents. We will be at your service 24 hours a day. Pls contact us freely.    

  Dicyandiamide curing agent belongs to the heating curing class of latent curing agent, solid at room temperature, insoluble in epoxy resin, dispersed in epoxy resin in the form of microparticles, through the heating reaction, once heated to the melting point of the vicinity of the start of the dissolution and rapid reaction curing.   Curing reaction of dicyandiamide The molecular structure of dicyandiamide contains a cyano group (-CN) in addition to four active hydrogens. Cyano group can also participate in the curing reaction as a functional group. The curing reaction temperature of dicyandiamide is generally in the range of 160~180°C, and the curing reaction time is 20~60 minutes. For bisphenol A epoxy resin with 190 epoxy equivalents, the theoretical dosage of dicyandiamide curing agent (calculated on the basis of active hydrogen equivalents) is 11.1 parts, but the actual dosage is often in the range of 4-10 parts (based on 100 parts of the resin by mass). Dicyandiamide micropowder is dispersed into the epoxy resin, has a suitable storage period, is stable in storage, does not delaminate, and does not cure.   The fineness of the dicyandiamide particles may vary from product to product. The finer the dicyandiamide particles, the more obvious the performance advantage for curing reaction Ultra-fine dicyandiamide particles are easier to be evenly dispersed into the epoxy resin liquid. Ultra-fine dicyandiamide particles can be better mixed and dissolved in the epoxy resin liquid than ordinary dicyandiamide.   Application areas of dicyandiamide curing compounds Dicyandiamide epoxy resin has good adhesive property, heat resistance and stable storage period. Dicyandiamide epoxy resins can be widely used in powder coatings, carbon fibre prepregs, heat curable inks, laminates, single component adhesives and other applications. Typical applications: Preparation of prepregs for the manufacture of reinforced composites (wind energy, automotive, aerospace, marine engineering and other industries). Electronic packaging materials, adhesives. Powder coatings (especially heavy duty anti-corrosion function). For epoxy-based adhesives (reinforced materials).   Nanjing Yolatech provides all kinds of high purity and low chlorine epoxy resins, including Bisphenol A epoxy resin, Bisphenol F epoxy resin, Phenolic epoxy resin, Brominated epoxy resin, DOPO modified phenolic epoxy resin, MDI modified epoxy resin, DCPD epoxy resin, Multifunctional epoxy resin, Crystalline epoxy resin, HBPA epoxy resin and so on. And we also could provide all kinds of curing agents or hardeners and diluents.   We will be at your service 24 hours a day. Pls contact us freely.    

Epoxy resin adhesive is a reprocessing or modification of epoxy resin to make its performance parameters meet specific requirements. Usually epoxy resin adhesives are also used with curing agents and need to be mixed well to be fully cured. Generally, the epoxy resin adhesive is called A adhesive or main agent, and the curing agent is called B adhesive or curing agent(hardener).   Main properties of epoxy resin adhesives before curing Colur, viscosity, specific gravity, proportioning, gel time, open time, curing time, thixotropy (flow stopping), hardness, surface tension, etc.   Main properties of epoxy resin adhesive after curing Resistivity, proof voltage, water absorption, compressive strength, tensile strength, shear strength, peel strength, impact strength, heat deflection temperature under load, glass transition temperature, internal stress, chemical resistance, elongation, shrinkage coefficient, thermal conductivity, electrical conductivity, weathering resistance, aging resistance, dielectric constant.   Curing characteristics of epoxy resin adhesive Most of the epoxy resin adhesives are heat-setting adhesives. The higher the temperature of the epoxy resin adhesive, the faster the curing. The more the amount mixed at one time, the faster the curing. The curing process has exothermic phenomenon, etc.   Nanjing Yolatech provides all kinds of high purity and low chlorine epoxy resins, including Bisphenol A epoxy resin, Bisphenol F epoxy resin, Phenolic epoxy resin, Brominated epoxy resin, DOPO modified phenolic epoxy resin, MDI modified epoxy resin, DCPD epoxy resin, Multifunctional epoxy resin, Crystalline epoxy resin, HBPA epoxy resin and so on. And we also could provide all kinds of curing agents or hardeners and diluents. We will be at your service 24 hours a day. Pls contact us freely.