Product Name: Triethylene Glycol Divinyl Ether Product Code: YLD-S0102 CAS No.: 765-12-8 Product Category: Active Diluent / Di-functional Vinyl Ether Monomer   1. Product Information Item Information Product Name Triethylene Glycol Divinyl Ether Other Names DVE-3；tri(ethylene glycol) divinyl ether；DIVINYL TRIETHYLENE GLYCOL DIETHER Product Code YLD-S0102 CAS No. 765-12-8 Molecular Formula C10H18O4 Molecular Weight 202.25 g/mol Category Low-volatility, low-viscosity di-functional vinyl ether monomer   2. Product Description YLD-S0102, Triethylene glycol divinyl ether, is a colorless to pale yellow liquid with low volatility. It is soluble in water and common organic solvents. With vinyl ether reactivity and flexible triethylene glycol ether chains, it can be used in light-curing, UV-curing adhesives, sealants, resins, coatings, spray paints and adhesive systems. As a reactive diluent or crosslinking monomer, it helps adjust formulation viscosity and participate in curing or crosslinking reactions.   3. Structure Features and Key Advantages 1. Di-functional vinyl ether structure YLD-S0102 contains two vinyl ether reactive groups and can participate in crosslinking reactions in relevant curing systems. 2. Low volatility and low viscosity The product has low volatility and is suitable for formulation systems requiring processing stability. It can also help reduce system viscosity and improve mixing, flow and processing operation. 3. Good system compatibility The flexible triethylene glycol ether chains support flexibility and compatibility in material systems. The product is soluble in water and common organic solvents, which makes it suitable for formulation development in resin, coating, sealant and adhesive systems.   4. Typical Properties Item Typical Value Appearance Colorless or light yellow liquid DVE-3 Content, % ≥98.0 Boiling Point, °C 120-126 Density, g/mL @25 °C 0.99 Moisture Content, % ≤0.20   Note: The above data are from Typical Properties in the company TDS. Final delivery specifications shall be subject to the company TDS / COA.   5. Features Feature Description Low volatility Helps reduce volatilization loss during use and is suitable for systems requiring processing stability. Reactive dilution Can reduce system viscosity while participating in the curing process, helping reduce the performance impact of inert diluents. Crosslinking ability The di-functional vinyl ether structure can participate in crosslinked network formation and is suitable for crosslinking agent and reactive monomer applications. System compatibility Soluble in water and common organic solvents, supporting formulation adjustment in coatings, adhesives, sealants and resin systems.   6. Applications 1. Light-curing and UV-curing systems YLD-S0102 can be used as a reactive diluent monomer in light-curing or UV-curing adhesives, sealants and coating systems to adjust formulation viscosity and participate in curing or crosslinking reactions. 2. Cross-linking agent With its di-functional vinyl ether structure, the product can be used as a crosslinking monomer in relevant polymer systems. The TDS mentions its use as a crosslinker in the production of polyacrylate ion exchange resins. 3. Sulfur based sealant YLD-S0102 can be used as a component in sulfur-based sealant compounds. Dosage and final performance should be confirmed by formulation testing. 4. Industrial systems such as coatings, resins and adhesives Due to its low volatility and solubility in water and common organic solvents, it can also be used in fibers, resins, coatings, spray paints and adhesives, mainly as a solvent, reactive diluent or modifier.   7. Storage, Packaging & Safety Item Information Packaging Drums；IBC tanks Storage temperature 5-30°C Storage & Handling Avoid direct sunlight and place in a cool and dry place. Avoid strong oxidants and acids. Storage Life 12 months from the date of manufacture in the original packing in ambient temperatures. Safety All safety information is provided in the Material Safety Data Sheet.  

Product Name: Diethylene Glycol Divinyl Ether Product Code: YLD-S0101 CAS No.: 764-99-8 Product Category: Active Diluent / Di-functional Vinyl Ether Monomer Chemical Structure   1. Product Information Item Information Product Name Diethylene Glycol Divinyl Ether Product Code YLD-S0101 Chemical Name 1-(2-[2-(Vinyloxy)ethoxy]ethoxy)ethylene, 1,1-[oxybis(2,1-ethanediyloxy)bis]ethene CAS No. 764-99-8 Molecular Formula C8H14O3 Molecular Weight 158.20 g/mol Category Low-viscosity, highly reactive di-functional vinyl ether monomer     2. Product Description YLD-S0101 is a low-viscosity, highly reactive di-functional vinyl ether monomer. The double bonds in its molecular structure give it rapid curing properties, while the flexible ether chains significantly improve the flexibility and hydrophilicity of the material. It can be used as an active diluent, cross-linking monomer or modifier and is widely applied in light-curing, UV-curing systems, coatings and adhesives to regulate the viscosity of the system and enhance the comprehensive performance of the cured product.   3. Structure Features and Key Advantages 1. Di-functional vinyl ether structure YLD-S0101 contains vinyl ether reactive groups and can be used in light-curing and UV-curing systems to support rapid curing. 2. Low viscosity and good diluting effect The company TDS lists Low viscosity and good diluting effect as key features, which support viscosity adjustment and processing performance in formulation systems. 3. Flexible ether chains The flexible ether chains help improve flexibility and hydrophilicity of the cured material, making it suitable for formulations requiring reactivity, flexibility and processability.   4. Typical Properties Item Typical Value Appearance Colorless transparent liquid Color, APHA ≤50 Purity, % ≥99.0 Water, % ≤0.5   Note: The above data are from Typical Properties in the company TDS. Final delivery specifications shall be subject to the company TDS / COA.   5. Features Feature Description Low viscosity Helps reduce system viscosity and improve flow, mixing and processing performance. Excellent reactivity The di-functional vinyl ether structure can participate in light-curing / UV-curing reactions and supports rapid curing. Good flexibility The flexible ether chains help improve the flexibility and overall performance of the cured product. Good diluting effect Can be used as an active diluent to adjust viscosity while participating in the curing reaction.   6. Applications 1. UV-curable coatings YLD-S0101 can be used in UV-curable coatings as an active diluent or cross-linking monomer for formulation development. 2. Electronic encapsulation materials YLD-S0101 can be used in Electronic encapsulation materials. Final suitability should be confirmed by end-use formulation testing. 3. Adhesives YLD-S0101 can be used in Adhesives to regulate system viscosity and enhance the comprehensive performance of the cured product. 4. Active diluent / cross-linking monomer / modifier YLD-S0101 can be used in light-curing and UV-curing systems to regulate viscosity, participate in cross-linking and improve cured material performance.   7. Storage, Packaging & Safety Item Information Packaging Drums Storage & Handling Storage in a cool and dry place. Avoid direct sunlight. Storage Life 12 months from the date of manufacture in the original sealed container at ambient temperature. Safety All safety information is provided in the Material Safety Data Sheet.   Note: This document is prepared for product information database use. Product parameters, features, applications and storage information are mainly based on the company TDS. For external use, the official TDS, MSDS, COA and contract terms shall prevail.

Product Name: 2-METHYLIMIDAZOLE Product Code: 2-MI CAS No.: 693-98-1 Product Category: Methyl-substituted imidazole compound     1. Product Information Item Information Product Name 2-METHYLIMIDAZOLE Chemical Name 2-Methyl-1H-imidazole；2-MI Product Code 2-MI CAS No. 693-98-1 Molecular Formula C4H6N2 Molecular Weight 82.10 g/mol Category Methyl-substituted imidazole compound   2. Product Description 2-MI is a methyl-substituted imidazole compound. According to the company TDS, it is white to off-white crystalline powder, soluble in water, alcohol, and acetone. The product is moisture absorbent. 2-MI can be used as Epoxy curing agent and Pharm intermediate. In epoxy resin systems, imidazole compounds are commonly used for curing or curing promotion. Final suitability should be confirmed by testing in the target formulation.   3. Structure Features and Performance Notes 1. Methylimidazole structure 2-MI contains an imidazole ring and a methyl substituent. This structure supports its application in epoxy curing-related systems. 2. Crystalline powder form The TDS describes the product as white to off-white crystalline powder and states that it is soluble in water, alcohol, and acetone. 3. Moisture absorbent The TDS states that the product is moisture absorbent. Therefore, storage and handling should avoid prolonged exposure to humid conditions.   4. Typical Properties Item Typical Value Appearance White to off-white crystalline powder Purity, % ≥99.0 Water, % ≤0.5   Note: The above data are from Typical Properties in the company TDS. Final delivery specifications shall be subject to the company TDS / COA.   5. Applications 1. Epoxy curing agent The company TDS lists Epoxy curing agent under Applications. Dosage and curing performance should be confirmed by testing in the final formulation. 2. Pharm intermediate The company TDS lists Pharm intermediate under Applications. Final use should be confirmed based on the specific synthesis route and customer application requirements. 3. Epoxy system applications 2-MI can be used as a related component in epoxy systems where imidazole compounds are required for curing reaction adjustment.   6. Storage, Packaging & Safety Item Information Packaging Drums Storage & Handling Store in a cool, ventilated warehouse, preferably in a well-sealed original container. Storage Life At least 12 months from the date of manufacture in the original packing in ambient temperatures. Handling Protection Contact of eyes and skin with this resin should be avoided, and it is recommended to wear a gas mask and gloves. Wear goggles or face shield when any splashes or droplets are possible. Safety All safety information is provided in the Material Safety Data Sheet.     7. Notice This document is prepared for product information database use. Product name, CAS No., typical properties, applications, storage and packaging information are mainly based on the company TDS. Molecular formula and molecular weight are cross-checked with public chemical databases. For external use, the official TDS, MSDS, COA and contract terms shall prevail.

Product Name: 2-METHYL-1,5-PENTANEDIAMINE Product Code: MPMD CAS No.: 15520-10-2 Product Category: Aliphatic Diamine / Amine Intermediate 1. Product Information Item Information Chemical Name 2-METHYL-1,5-PENTANEDIAMINE Product Code MPMD Other Names 1,5-DIAMINO-2-METHYLPENTANE；2-Methylpentamethylenediamine；1,5-Pentanediamine, 2-Methyl CAS No. 15520-10-2 Molecular Formula C6H16N2 Molecular Weight 116.20 g/mol Category Aliphatic diamine compound     2. Product Description MPMD is an aliphatic diamine compound containing two primary amine functional groups. According to the company TDS, MPMD has unique properties such as low viscosity, high elasticity and good compatibility. It can be used in coatings, polyurethane, polyurea, hot melt adhesives, high performance polyamides, neutralizing or buffering agents and metalworking fluids. Using dibasic acids, high molecular weight polyamine polymers and copolymers are generated. Compared with polymers and copolymers prepared using hexamethylenediamine compounds, these compounds have low melting points and low crystallinity.   3. Structure Features and Key Advantages 1. Two primary amine functional groups MPMD contains two primary amine functional groups. According to the TDS, the two primary amine functional groups have different reactivity, which supports formulation design and reaction rate adjustment. 2. Low viscosity and good compatibility MPMD provides low viscosity and good compatibility, which helps improve mixing, flow and processing operation in resin systems. Application performance should be confirmed by testing in the final formulation. 3. Elasticity improvement According to the TDS, MPMD can improve the elasticity of polyamine hot melt adhesives and extend their air exposure time. The epoxy resin curing agent produced with 2-methylpentanediamine has a low adduct viscosity and can promote the improvement of resin formulation through its elasticity.   4. Typical Properties Item Typical Value Appearance Colorless liquid Color (APHA) ≤2 Purity, wt% ≥99.0 Other diamines content, wt% ≤1.0 Specific Gravity, 25 °C 0.86 Moisture Content, wt% ≤0.50   Note: The above data are from Typical Properties in the company TDS. Final delivery specifications shall be subject to the company TDS / COA.   5. Applications 1. Industrial and Marine coatings MPMD can be used in Industrial and Marine coatings. The dosage, curing behavior and coating performance should be confirmed by formulation testing. 2. Decorative coatings MPMD can be used in Decorative coatings as an amine component for formulation development. 3. Low-temperature curative, Accelerator MPMD can be used as a Low-temperature curative or Accelerator in systems requiring low-temperature curing or improved curing efficiency. 4. Polyurethane and Polyurea MPMD can be applied in Polyurethane and Polyurea systems. Final suitability should be confirmed by formulation and process testing. 5. Hot melt adhesives and High performance polyamides MPMD can be used in Hot melt adhesives and High performance polyamides. The TDS states that it can improve the elasticity of polyamine hot melt adhesives and extend their air exposure time. 6. Neutralizing or buffering agent; Metalworking fluids MPMD can also be used as a Neutralizing or buffering agent and in Metalworking fluids. Final suitability should be confirmed by application testing.   6. Storage, Packaging & Safety Item Information Packaging Drums；IBC tanks Storage temperature 5-30°C Storage & Handling Avoid direct sunlight and place in a cool and dry place, Avoid strong oxidants, acids. Storage Life 12 months from the date of manufacture in the original packing in ambient temperatures. Safety All safety information is provided in the Material Safety Data Sheet.   7. Notice This document is prepared for product information database use. Product parameters and application information are mainly based on the company TDS. Molecular formula and molecular weight are cross-checked with public chemical databases. For external use, the official TDS, MSDS, COA and contract terms shall prevail.

Product Name: 2-PhenylimidazoleProduct Number: 2-PICAS No.: 670-96-2Product Category: Aromatic imidazole       1. Product Information Item Information Product Name 2-Phenylimidazole Product Number 2-PI Internal Code YLMZ-2B CAS No. 670-96-2 EC No. 211-581-7 Category Aromatic imidazole Molecular Formula C9H8N2 Molecular Weight 144.17 g/mol   2. Product Description 2-PI is Aromatic imidazole. It is used in Powder coating and Epoxy coating applications. According to the TDS, it can be used as both a curing agent and a curing promoter in powder coatings. The imidazole structure can participate in epoxy curing reactions, while the phenyl structure contributes to final coating performance.   3. Structure Features and Key Advantages 1. Aromatic imidazole structure 2-PI contains both an imidazole ring and a phenyl ring. This structure supports its application in epoxy curing systems and coating formulations. 2. Curing agent and curing promoter The TDS states that 2-PI can be used as both a curing agent and a curing promoter in powder coatings. It can help adjust curing rate and curing temperature in epoxy systems. 3. Coating performance improvement • Shortening the curing time of powder coatings • Lowering the curing temperature • Improving the mechanical properties of the coating film • Improving compatibility with resins • Increasing the flexibility of cured products   4. Technical Data Item Typical Value Appearance Off white to light yellow crystals Purity,% ≥99.0 Melting point,℃ 140-150 moisture content,% ≤0.5   Note: The above data are from Typical Properties in the company TDS. Final delivery specifications shall be subject to the company TDS / COA.   5. MSDS Identification and Safety Information Item Information Product Name 2-Phenylimidazole Product Number 2-PI Chemical Name 2-Phenylimidazole CAS No. 670-96-2 EC No. 211-581-7   GHS Hazard Statements • H302: Harmful if swallowed. • H315: Causes skin irritation. • H319: Causes serious eye irritation. • H335: May cause respiratory irritation. Avoid breathing dust and avoid contact with skin and eyes. Wear protective gloves / protective clothing / eye protection / face protection. Please refer to MSDS for detailed safety information.   6. Applications 1. Powder coating 2-PI can be used in powder coating systems as a curing agent or curing promoter. It helps shorten curing time, lower curing temperature and improve mechanical properties of the coating film. 2. Epoxy coating 2-PI can be used in epoxy coating systems to improve curing efficiency and overall coating performance. 3. Epoxy curing system In epoxy resin systems, 2-PI can be used together with other curing agents according to formulation requirements to adjust curing speed, reduce curing temperature or improve cured product performance.   7. Packaging, Storage & Safety Item Information Packaging 25KG Storage temperature 5-25 ℃ Storage & Handling Avoid direct sunlight and place in a cool and dry place；Avoid strong oxidants, acids. Storage Life At least 12 months from the date of manufacture in the original packing in ambient temperatures.

Product Code: DMP-30 / Tris-DMPCAS No.: 90-72-2Product Category: Epoxy Curing Accelerator / Co-curing Agent   1. Product Information Item Information Chemical Name 2,4,6-Tris[(dimethylamino)methyl]phenol Common Name 2,4,6-Tris(dimethylaminomethyl)phenol Product Code / Trade Name DMP-30 / Tris-DMP CAS No. 90-72-2 EC No. 202-013-9 Molecular Formula C15H27N3O Molecular Weight 265.39 g/mol Linear Formula [(CH3)2NCH2]3C6H2OH Category Tertiary amine phenolic epoxy curing accelerator / Mannich base   2. Product Description DMP-30 is a Mannich base type epoxy curing accelerator containing tertiary amine groups and a phenolic hydroxyl group. In epoxy resin systems, its tertiary amine structure acts as a Lewis base catalyst and promotes curing reactions, while the phenolic hydroxyl group contributes to activation in epoxy formulations. It is commonly used as an epoxy curing accelerator, catalyst, or co-curing agent in systems requiring faster room-temperature curing, improved early strength development, or better processing efficiency.   3. Structural Features and Key Advantages 3.1 Structural Features The DMP-30 molecule contains three dimethylaminomethyl groups and one phenolic hydroxyl group. This structure provides high catalytic activity in epoxy resin systems and allows DMP-30 to work with various epoxy resins and curing agent systems. 3.2 Key Advantages • Effective cure acceleration: accelerates curing reactions in epoxy systems and supports room-temperature or medium/low-temperature curing. • Good formulation adaptability: can be used with amine, polyamide, anhydride and other epoxy curing systems. • Low dosage as accelerator: normally used at relatively low addition levels in epoxy formulations. • Improved processing efficiency: helps shorten tack-free and curing time and improve production or application turnover. • Wide application range: suitable for adhesives, coatings, potting, casting, composites and concrete repair epoxy systems.   4. Typical Technical Information The following data are typical values collected from publicly available sources for internal product database reference only. Official sales, quotation or technical commitment should be based on company TDS, MSDS, COA or mutually confirmed documents. Item Typical Information Appearance Light yellow to yellow liquid / amber to red-brown liquid (description may vary by supplier) Odor Amine odor Molecular Formula C15H27N3O Molecular Weight 265.39 g/mol Boiling Point Approx. 316°C (public supplier data) Viscosity Approx. 200 cps (public supplier data; not company specification) Refractive Index n20/D 1.515 (public supplier data) Transport Information Amines, liquid, corrosive, n.o.s.; Class 8; Packing Group III (refer to actual MSDS)   5. Applications Application Field Function / Description Epoxy Curing Accelerator Accelerates epoxy curing reactions and improves curing speed at room temperature or medium/low temperature. Adhesives and Sealants Used in industrial adhesive systems requiring faster cure response and strength development. Coatings and Protective Systems Used in epoxy coatings, floor coatings and anti-corrosion coating formulations to improve cure speed. Potting and Casting Systems Used in electronic potting, casting resin and industrial casting formulations to adjust curing reaction. Composites and Construction Materials Can be used in epoxy composites, concrete repair and structural bonding applications.   6. Packaging, Storage and Safety Packaging: usually available in drums or other industrial packaging according to supplier specifications. Actual packaging should follow company delivery arrangement. Storage: keep tightly sealed in a cool, dry and well-ventilated place. Avoid heat, direct sunlight and moisture ingress. Keep away from strong oxidizing agents, strong acids and incompatible materials. Safety: the product may present corrosive and irritant hazards. Wear protective gloves, safety goggles and protective clothing during handling. Refer to the MSDS for detailed safety information.

Product Name: 1,6-HEXANEDIAMINE CAS No.: 124-09-4 Chemical Name: 1,6-Hexanediamine；HMDA；1,6-Diaminohexane；Hexamethylene diamine   1. Product Information Item Information Chemical Name 1,6-Hexanediamine；HMDA；1,6-Diaminohexane；Hexamethylene diamine CAS No. 124-09-4 Product Category Aliphatic diamine; epoxy curing agent and polyamide resin raw material Appearance Colorless flake crystals Main Applications Isocyanates; Epoxy curing agents; Polyamide resins, adhesives, inks; Water treatment chemicals   2. Description 1,6-HEXANEDIAMINE is colorless flake crystals with ammonia odor. It is soluble in water, ethanol and ether. It is easy to deliquescence, flammable, toxic. It easily absorbs moisture and carbon dioxide in the air. Hexamethylenediamine is mainly used in the synthesis of nylon 66 and 610 resin, also used to synthesize polyurethane resin, ion exchange resin and hexyl diisocyanate. It is used as a curing agent for urea-formaldehyde resin, epoxy resin, organic cross-linking agent, etc. It is also used as a stabilizer in the textile and paper industry, bleaching agent, aluminum alloy corrosion inhibitor and neoprene emulsifier.   3. Structural Features and Key Properties 1,6-HEXANEDIAMINE contains two terminal primary amino groups and shows typical reactivity of aliphatic diamines. This structure makes it suitable for polymerization, cross-linking and curing reactions in multiple chemical material systems. • Two terminal primary amino groups for curing and cross-linking applications. • Important raw material for nylon 66 and 610 resin. • Soluble in water, ethanol and ether. • Easy to deliquescence and absorbs moisture and carbon dioxide in the air. • Flammable and toxic; operators should use protective equipment and follow MSDS requirements.   4. Specification Properties Specification Properties Value Appearance Colorless flake crystals Purity, % Min. 99.90 Water, wt.% Max. 0.05 Crystallization point, °C Min. 40.9 Color, Hazen Max. 5 Polarographic value, mmol/t Max. 100.0 Trans-diaminocyclohexane, mg/kg Max. 10.0   5. Applications • Isocyanates • Epoxy curing agents • Petroleum additives • Polyamide resins, adhesives, inks, • Scale and corrosion inhibitors • Water treatment chemicals   6. Packaging • Drums • Other packages   7. Safety Store in a cool, ventilated warehouse. Keep away from tinder, heat sources. The library temperature should not exceed 37 °C. The packaging should be sealed and not in contact with air. Should be stored separately from the oxidant, avoid mixed storage. Explosion-proof lighting and ventilation facilities are adopted. It is forbidden to use mechanical equipment and tools that are prone to sparks. Storage areas should be equipped with emergency treatment equipment for leakage and suitable containment materials. Operators should wear protective equipment to avoid direct contact with this product. When processing, using, and disposing of this product, the relevant safety and health laws and regulations of the country and region shall be observed. All safety information is provided in the Material Safety Data Sheet.   8. Notice The information contained herein is for product database and reference purposes. The user should perform his/her own tests to determine the suitability for a particular purpose. Final product use and safety compliance should follow the latest TDS, MSDS and COA documents.

Product Code: PDACAS No.: 462-94-2Product Category: Linear Aliphatic Diamine / Bio-based Polyamide Monomer / Epoxy Curing Agent Raw Material 1. Product Information Item Information Chinese Name 1,5-戊二胺 English Name 1,5-Pentanediamine IUPAC Name Pentane-1,5-diamine Abbreviation PDA Synonyms 1,5-Diaminopentane; Pentamethylenediamine; Cadaverine CAS No. 462-94-2 Molecular Formula C5H14N2 Molecular Weight 102.18 g/mol Product Category Linear aliphatic diamine; bio-based polyamide monomer; epoxy curing agent raw material / modified hardener raw material   2. Product Description 1,5-Pentanediamine (PDA) is a five-carbon linear aliphatic diamine containing two primary amino groups. Due to its high amine reactivity, PDA can react with carboxylic acids, anhydrides, epoxy groups and isocyanates. It is an important intermediate for polyamides, polyurethanes, epoxy curing systems and various fine chemicals.   In material applications, PDA can be used as a bio-based polyamide monomer for PA56, PA510 and related materials. It can also be used for preparing or modifying epoxy resin curing agents. Compared with aromatic amines, PDA is an aliphatic diamine with higher reactivity and is often used in systems requiring fast reaction, flexible chain segments or bio-based material concepts.   3. Structural Features and Reactivity The structure of PDA can be represented as H2N-(CH2)5-NH2. Its linear chain and two primary amino groups determine its typical aliphatic amine reactivity. • Two primary amino groups: react with epoxy groups to form crosslinked networks and react with dicarboxylic acids to form polyamide salts for further polymerization. • Five-carbon linear chain: introduces flexible chain segments into polymers and may help improve toughness and processing adaptability. • High reactivity: in epoxy systems, PDA generally cures rapidly; pot life and exotherm should be carefully evaluated in formulation development. • Bio-based development potential: PDA can be produced through bio-fermentation routes and is an important monomer in the bio-based polyamide value chain.   4. Key Advantages • High reactivity for polyamide polycondensation, epoxy curing and isocyanate derivative preparation. • Low-molecular-weight aliphatic diamine, which can increase reaction efficiency and crosslink density; curing speed should be controlled in epoxy formulations. • Good water solubility and solvent compatibility for various synthesis systems. • Suitable for bio-based material development, including bio-based nylon, engineering plastics, fibers and films. • Broad application scope covering polyamides, polyurethanes, epoxy curing agents, pharmaceutical/agrochemical intermediates and organic synthesis intermediates. 5. Technical Data Item Typical Value Appearance Colorless to yellow liquid with characteristic amine odor CAS No. 462-94-2 Molecular Formula C5H14N2 Molecular Weight 102.18 g/mol Melting Point Approx. 9°C Boiling Point 178-180°C Density Approx. 0.873 g/mL at 25°C Flash Point Approx. 63°C / 145°F Water Solubility Soluble Sensitivity Air sensitive & hygroscopic   Note: The above values are typical data from public references and do not constitute product specifications. Final quality specifications should follow the company TDS, COA or contract agreement.   6. Main Applications 1. Bio-based Polyamide Monomer PDA is an important diamine monomer for bio-based polyamides. It can react with dicarboxylic acids such as adipic acid and sebacic acid to produce PA56, PA510 and related polyamide materials. These materials can be used in fibers, engineering plastics, films, hot-melt adhesives and functional materials.   2. Epoxy Resin Curing Agent and Modified Hardener Raw Material PDA contains two primary amino groups and can react with epoxy resins to form crosslinked structures. Due to its high reactivity, pot life, exotherm and application window should be evaluated when PDA is used directly in epoxy systems. In industrial applications, it can also be used as a raw material for modified amine curing agents or blended hardener systems for coatings, adhesives and composite materials.   3. Polyurethane and PDI-related Raw Material PDA can be used as a five-carbon diamine raw material for developing pentamethylene diisocyanate (PDI) and related polyurethane systems, including high-performance coatings, elastomers and adhesives.   4. Organic Synthesis Intermediate PDA can also be used in pharmaceuticals, agrochemicals, surfactants, chelating agents and other fine chemical synthesis fields.   7. Packaging, Storage and Safety Packaging: Common packaging forms may include drums or IBC tanks. Actual packaging should follow the company specification and sales contract. Storage: Keep the container tightly closed in a cool, dry and well-ventilated place. Avoid heat, direct sunlight, and long-term exposure to air and moisture. Keep away from acids, strong oxidants and incompatible materials. Safety: PDA is a corrosive amine chemical. It may cause severe skin burns and eye damage and may cause respiratory irritation. Wear protective gloves, safety goggles and protective clothing, and ensure adequate ventilation during handling. Refer to MSDS for detailed safety information.   8. Data Note This document is prepared for internal product database and foreign trade development reference. Since the company TDS/MSDS/COA was not provided for this product, technical values are organized from public chemical references. External quotation, sample communication and contract documents should follow the official company TDS, MSDS and COA.

Core Overview Methylcyclohexanediamine (abbreviated as HTDA or MCHDA) is a high-performance alicyclic diamine epoxy resin curing agent. With its unique molecular structure (cyclohexane backbone + methyl group), it achieves an excellent balance between high rigidity and toughness, and is regarded as a strategic material choice for breaking through the performance limitations of epoxy resin systems and developing high-end competitive products.   Core Performance Advantages 1. High Rigidity & High Heat Resistance • Reason: Its molecular core is a rigid cyclohexane backbone. • Result: It provides the cured product with excellent thermal stability, high glass transition temperature (Tg), creep resistance and dimensional stability, making it suitable for high-temperature and heavy-load environments.   2. Excellent Toughness • Reason: The methyl group in the molecule introduces steric hindrance and optimizes the flexibility of molecular chain segments. • Result: It effectively overcomes the brittleness of traditional alicyclic amines such as IPDA and significantly improves impact resistance.   3. Excellent Weather Resistance • Reason: The molecular structure contains no benzene ring and is a saturated alicyclic structure. • Result: It fundamentally avoids oxidative yellowing under ultraviolet irradiation. The cured product does not yellow under UV exposure and maintains stable color at high temperature, making it especially suitable for outdoor coatings, topcoats and other applications with strict appearance requirements.   4. Process Friendliness • Low viscosity: It has good wetting performance in epoxy resin systems, which is beneficial for mixing, defoaming and filling complex shapes. • Low volatility and environmental safety: As a larger-molecule curing agent, HTDA has low vapor pressure and low volatility, with less odor in the production environment and significantly reduced health hazards to operators, meeting modern environmental standards.   Physicochemical Properties Property Typical Value Appearance Colorless to pale yellow transparent liquid Color (Hazen) ≤40 Odor Slight ammonia odor Viscosity 5-15 mPa·s/25°C Water Content (ppm) ≤1000 Amine Value 820-880 mg KOH/g Density ≈0.94 g/mm3 Freezing Point -92°C Boiling Point ≈208°C Active Hydrogen Equivalent (AHEW) ≈32 g/eq Molecular Formula C₇H₁₆N₂ Molecular Weight 128.22 Isomers Exists as multiple isomers such as cis and trans; differences in spatial structure affect reactivity and application performance. Miscibility Good miscibility with organic solvents such as alcohols and ethers. Safety The product has certain toxicity. Professional protective equipment is required during operation, and safety procedures should be strictly followed.     Storage Notes Store in a cool and ventilated warehouse. The storage temperature should not exceed 40°C. It should be stored separately from oxidants and edible chemicals, and mixed storage is strictly prohibited. Suitable container materials include glass and high-density polyethylene. Keep the container tightly closed. Keep away from fire and heat sources. The warehouse must be equipped with lightning protection devices. The exhaust system should be equipped with grounding devices for static electricity discharge. Explosion-proof lighting and ventilation should be used. Equipment and tools that may generate sparks are prohibited. The storage area should be equipped with leakage emergency treatment equipment and suitable containment materials.   Main Application Fields Application Field Core Application Scenario Key Performance Support High-performance composites Wind turbine blades, aerospace components, high-end sports equipment (bicycle frames, rackets) High Tg, excellent fatigue strength, good toughness, environmental aging resistance Electronic and electrical field Chip encapsulation (Underfill/Glob Top), transformer casting, high-voltage insulators Excellent electrical insulation, low dielectric loss, low curing stress, resistance to high and low temperature and high humidity Anti-corrosion coatings Offshore platforms, chemical storage tanks, pipeline inner walls, high-end decorative topcoats, automotive clear coats Dense cross-linked network, chemical corrosion resistance, excellent weather resistance, gloss and color retention Structural adhesives Building structural reinforcement, automotive structural bonding, aerospace assembly High shear and peel strength, excellent durability Industrial flooring Factory workshops, warehouse wear-resistant floors, pharmaceutical plant anti-corrosion floors Mechanical wear resistance, heavy-load impact resistance, chemical corrosion resistance     Performance data The curing time at room temperature for 100:16 (128 resin) is 1 hour and 55 minutes. Component Count the number of portions by weight Standard epoxy resin based on double A (EEW = 185 g/eq) 100 HTDA (AHEW = 33 g/eq) 18 Hybrid characteristics Test data Test method The viscosity of the mixture at 23°C 1300 mPa·s DIN EN ISO 3219 The operating time at 23°C 69 min DIN 16945 The time to reach 6 Pa·s at 23°C 131 min DIN 16945 The time to reach 6 Pa·s at 45°C 69 min DIN 16945 The time to reach 6 Pa·s at 75°C 17 min DIN 16945 Gel time (70°C) 51 min ASTM D4473 Gel time (90°C) 25 min ASTM D4473 Gel time (110°C) 7 min ASTM D4473 Curing procedures: 2h-80°C, 2h-100°C, 2h-100°C, 2h-120°C, 2h-140°C, 2h-160°C.   Mechanical properties Mechanical properties Unit of value Test method Tg 75°C DSC, mod., 5 K/min Thermal deformation (HDT) 73°C DIN EN ISO 75-2 Tensile strength 53 MPa DIN EN ISO 527-2 Tensile modulus 2391 MPa DIN EN ISO 527-2 The maximum tensile elongation 4.9% DIN EN ISO 527-2 Bending strength 86 MPa DIN EN ISO 178 Bending modulus 2487 MPa DIN EN ISO 178 Simply supported beam (impact strength) 73 kJ/m² DIN EN ISO 179-1   Core Value of Choosing HTDA When your application faces challenges such as high temperature, heavy load, strong corrosion, long service life or strict appearance requirements, HTDA is regarded as a key material to open the door to high-performance epoxy systems. It perfectly combines the high-strength advantages of traditional alicyclic amines with significantly improved toughness, weather resistance and process friendliness, helping your products establish a solid performance foundation in intense market competition.   Summary Methylcyclohexanediamine (HTDA) is a specialty curing agent designed for high-performance applications. It effectively solves the contradiction of traditional alicyclic amines, namely high rigidity but high brittleness. With outstanding comprehensive performance, it is one of the preferred high-end materials for epoxy formulators pursuing high heat resistance, high strength, high toughness, high weather resistance and environmental friendliness.

Product Code: 1,3-BDX CAS No.: 135470-04-1 Product Category: Epoxy Curing Agent   1. Product Information Item Information Chemical Name 1,3-Benzenedimethanamine Reaction Products with Epichlorohydrin Product Code 1,3-BDX CAS No. 135470-04-1 Category Modified amine epoxy curing agent Main Applications Epoxy coatings, floor coatings, industrial protective coatings, adhesives   2. Product Description 1,3-BDX is a modified amine epoxy curing agent derived from MXDA. It is designed for epoxy curing systems that require good color stability, moderate viscosity, fast curing performance, wet surface adhesion and excellent chemical resistance.   In epoxy resin systems, 1,3-BDX can be used directly as a curing agent or combined with other amine curing agents to improve processability, adjust curing speed and enhance corrosion resistance and water resistance of cured products. It is suitable for floor coatings, industrial protective coatings and adhesive systems requiring adhesion and durability.   3. Structure Features and Key Advantages 3.1 Structure and Reactivity 1,3-BDX is based on an MXDA-derived modified amine system. It retains amine reactivity toward epoxy resin while improving compatibility and application stability. Compared with conventional low-molecular amine curing agents, it offers a balanced profile of processability, wet surface adhesion, later-stage curing speed and resistance properties.   3.2 Key Advantages · Good color stability for appearance-sensitive coatings and adhesives. · Moderate viscosity for easier mixing with epoxy resin and formulation adjustment. · Fast curing performance to improve application efficiency and shorten curing time. · Good wet surface adhesion for demanding application conditions. · Excellent corrosion and water resistance for long-term durability. · Flexible formulation use: suitable for direct use or blending with other curing agents as an accelerator or performance modifier.   4. Technical Data Item Typical Value Appearance Clear liquid Color, Gardner ≤5 Viscosity, cps @25°C 7000-14000 Total Amine, mg KOH/g 650-680 MXDA Content, % 24-30 Note: The above values are typical data for product identification and formulation reference only. They should not be considered as a performance guarantee. End users should conduct their own tests based on specific resin systems, formulations and application conditions.   5. Applications 5.1 Epoxy Floor Coatings 1,3-BDX can be used in epoxy floor coating systems to support processability, curing speed, wear resistance, water resistance and chemical resistance.   5.2 Industrial Protective Coatings It is suitable for industrial equipment, concrete substrates and metal protection, helping improve adhesion, corrosion resistance and long-term durability.   5.3 Adhesive Systems It can be used in industrial adhesive or structural adhesive systems requiring adhesion, water resistance and chemical resistance.   5.4 Blended Curing Systems 1,3-BDX can be blended with other amine curing agents as a curing accelerator or performance modifier to balance pot life, curing speed and final properties.   6. Packaging, Storage and Safety Item Information Packaging Drums; IBC tanks Storage Temperature 5-30°C Storage Conditions Keep sealed in a cool and dry place. Avoid direct sunlight. Avoid Contact Strong oxidants and acids Storage Life 12 months from the date of manufacture in the original packing under ambient temperatures Safety Refer to MSDS for detailed handling, transportation and safety information     7. Sales Keywords 1,3-BDX supplier; epoxy curing agent supplier; MXDA modified curing agent; floor coating hardener; industrial coating curing agent; epoxy adhesive hardener

Product: 1,3-Cyclohexanebis(methylamine)CAS No.: 2579-20-6Code: 1,3-BAC / HXDA   1. Product Information Item Information Product Name 1,3-Cyclohexanebis(methylamine) CAS No. 2579-20-6 Formula C8H18N2 Molecular Weight 142.24 g/mol Category Alicyclic Diamine Compound   2. Product Description 1,3-BAC is an important alicyclic diamine compound containing two primary amino groups. It provides excellent reactivity, low viscosity and good processing performance. Due to its non-aromatic molecular structure, it improves weather resistance, anti-yellowing performance and long-term stability of polymer materials.   3. Key Advantages · Low viscosity and excellent processability · Fast curing performance · Excellent anti-yellowing and weather resistance · Good chemical resistance and durability · Suitable for high-performance polymer applications   4. Technical Data Item Information Appearance Colorless transparent liquid Purity ≥99.0% Viscosity 9.1 mPa·s at 20℃ Density 0.940-0.950 g/cm³ at 25℃ Freezing Point < -70℃ Boiling Point Approx. 220℃ Flash Point Approx. 113℃   5. Applications Epoxy Resin Curing Agent: coatings, adhesives, electronic encapsulation and composite materials.Polyurethane Industry: raw material for alicyclic isocyanates and advanced polyurethane systems.Specialty Polymers: used in development of high-performance cycloaliphatic polymers.   6. Packaging, Storage & Safety Packaging: 190kg iron drum.Storage: Keep sealed in a cool and dry place. Avoid heat, sunlight, acids and oxidizing agents.Safety: Corrosive chemical. Use appropriate protective equipment and refer to MSDS.

DETA (Diethylenetriamine)   Appearance: Colorless to pale yellow transparent liquidChemical formula: C₄H₁₃N₃Molecular weight: 103.166CAS No.: 111-40-0Melting point: -40 °CBoiling point: 206 °CDensity: 0.96 g/cm³Amine value (mg KOH/g): 1300–1400Viscosity (25 °C) mPa·s: 5–20Mixing ratio: YLE-128 (E-51) epoxy resin : DETA (Diethylenetriamine) = 100 g : 10–11 g (by weight) YLE-220 (E-44) epoxy resin : DETA (Diethylenetriamine) = 100 g : 10 g (by weight)Curing conditions: 25 °C / 3–6 hours or 60 °C / 1–2 hours   TETA (Triethylenetetramine)   Appearance: Colorless to slightly yellow viscous liquidChemical formula: C₆H₁₈N₄Molecular weight: 146.234CAS No.: 112-24-3Melting point: 12 °CBoiling point: 266–267 °CDensity: 0.982 g/cm³Flash point: 135 °C (CC)Amine value (mg KOH/g): 1100–1200Viscosity (25 °C) mPa·s: 5–30Mixing ratio: YLE-128 (E-51) epoxy resin : TETA (triethylenetetramine) = 100 g : 13–14 g (by weight) YLE-220 (E-44) epoxy resin : TETA (triethylenetetramine) = 100 g : 11–13 g (by weight)Curing conditions: 25 °C / 3–6 hours or 60 °C / 1–2 hours   Polyether amine curing agent Chemical name: Polyether amine; Polyether polyamine; Polyetheramine (PEA); Aliases: Polypropylene glycol bis(2-aminopropyl ether); 2-(Aminooxy)propan-1-amineCAS No.: 9046-10-0   Polyether amine curing agent D-230 Mixing ratio: YLE-128 (E-51) epoxy resin : D-230 = 100 g : 30 gCuring conditions: 25 °C / 36 hours or 60 °C / 3 hours or 80 °C / 1 hourCured product characteristics: Colorless and transparent, high hardness, high toughness, not easily brittle. Suitable for handicrafts, nameplates, and potting applications with special requirements.   Polyether amine curing agent D-400 Mixing ratio: YLE-128 (E-51) epoxy resin : D-400 = 100 g : 50 gCharacteristics: Good toughness after curing, low viscosity, high mechanical performance of the cured product, and resistance to high-low temperature thermal shock (-35 °C to 120 °C).   Polyether amine curing agent D-2000 Mixing ratio: YLE-128 (E-51) epoxy resin : D-2000 = 40 g : 100 gCuring conditions: 80 °C / 6–10 hoursCharacteristics: D-2000 is colorless and transparent. The cured product exhibits excellent elasticity, high peel strength, colorless transparency, high toughness, not easily brittle, and strong adhesion. Suitable for potting applications with special requirements, and resistance to high-low temperature thermal shock (-40 °C to 130 °C). When combined with liquid epoxy resin, D-2000 is used for colorless and transparent applications in composites, wind power, handicrafts, and nameplates. TYPE D-230 D-400 T403 D-2000 D-5000 Appearance Colorless transparent liquid Colorless transparent liquid Colorless transparent liquid Colorless transparent liquid Colorless transparent liquid Viscosity (MPa·s / 25℃) 3~10 10~50 500~200 260~280 300~600 Density (25℃, g/cm³) 0.92~0.98 0.92~0.98 0.92~0.98 0.92~0.98 0.92~0.98 Active Hydrogen Equivalent 58 100 85 500 1250 Film Drying Time (25℃) 36 hours 72 hours 24 hours 100 hours 500 hours Recommended Mixing Ratio (with E51) 10g : 3g 10g : 5g 10g : 4.5g 10g : 25g 10g : 65g Pot Life (Min / 25℃) ≥3 hours ≥6 hours ≥4 hours ≥24 hours ≥48 hours Curing Conditions 80°C / 6~10 hrs 80°C / 6~10 hrs 80°C / 6~10 hrs 80°C / 6~10 hrs 80°C / 6~10 hrs Cured Hardness (Shore) 90D 65D 85D D20 --     1,3-BAC (1,3-Bis(aminomethyl)cyclohexane)  CAS No.: 2579-20-6 13-BAC is primarily used as an epoxy curing agent or for the preparation of modified epoxy curing agents. Compared to aromatic amine curing agents, it not only has lower viscosity and better handling properties but also yields cured products with outstanding resistance to ultraviolet light (anti-yellowing), as well as excellent weather resistance, temperature resistance, water resistance, and chemical resistance. Moreover, it cures rapidly and can be used for curing at either room temperature or low temperatures. It is widely applied in high-end outdoor floor coatings, stone adhesives, electronic potting compounds, composite materials (such as automotive parts and wind turbine blades), and in the fields of jewelry adhesives and crystal adhesives where appearance and color quality are of paramount importance.Mixing ratio: YLE-128 (E-51) epoxy resin : 1,3-BAC = 100 g : 18–20 gCuring conditions: 25 °C / 6–12 hours   MXDA (m-Xylylenediamine)  CAS No.: 1477-55-0Characteristics: m-Xylylenediamine is a high-performance and widely used epoxy resin curing agent, and also an important fine chemical intermediate. It can be used in the synthesis of polyurethanes, a range of epoxy resins, rubber additives, photosensitive plastics, pesticides, fiber finishing agents, rust inhibitors, chelating agents, lubricants, paper processing agents, and electronic chemicals. In nylon products such as MXD6 (a polycondensate of MXDA and adipic acid), and in the synthesis of functional epoxy resins, MXDA is widely utilized due to its unique structure, which imparts various excellent physical and chemical properties.Mixing ratio: YLE-128 (E-51) epoxy resin : MXDA = 100 g : 18–20 gCuring conditions: 50–60 °C / 3 hours + 120–150 °C / 2 hours   DETDA (Diethyltoluenediamine)  CAS No.: 68479-98-1Characteristics: DETDA is equivalent to Ethancure 100 and Lonza DETDA 80. It is a highly effective chain extender for polyurethane elastomers, and can also be used as a curing agent for polyurethanes and epoxy resins, as an antioxidant for epoxy resins, and in industrial oils and lubricants. Additionally, it serves as an intermediate for organic synthesis.Mixing ratio: YLE-128 (E-51) epoxy resin : DETDA = 100 g : 25 gCuring conditions: 100 °C / 4 hours + 150 °C / 1 hour   PACM: 4,4'-Diaminodicyclohexylmethane CAS No.: 1761-71-3PACM curing agent (hydrogenated MDA) has performance equivalent to Air Products' Amicure PACM and BASF's DC (i.e., Baxxodur EC330). It is used as an epoxy resin curing agent and as a curing agent for epoxy composite materials. It is also applied as a chain extender and additive in polyaspartic esters, polyamides (PA), polyurethanes (PU), and polyurea spray elastomers (SPUA). Application fields include high-grade composites, filament winding, lamination, casting, RIM, pultrusion, etc.Mixing ratio: YLE-128 (E-51) epoxy resin : PACM = 100 g : 25–30 gCuring conditions: 25 °C / 24 hours or 60 °C / 3 hours   DDS: 4,4'-Diaminodiphenyl sulfone CAS No.: 80-08-04,4'-Diaminodiphenyl sulfone is an epoxy resin curing agent with excellent high-temperature resistance. It is used in high-temperature-resistant prepregs, high-temperature-resistant molded products (automotive molds, rail transit, aerospace, etc.), and high-temperature-resistant laminates.Mixing ratio: YLE-128 (E-51) epoxy resin : DDS = 100 g : 25–35 gCuring conditions: 130 °C / 2 h + 200 °C / 2 h   DDM: 4,4'-Diaminodiphenylmethane CAS No.: 101-77-9Liquid DDM product is a mixture containing approximately 60% 4,4'-diaminodiphenylmethane and 40% polyphenyl polymethylene polyamine, appearing as a light yellow viscous liquid at room temperature. DDM is an important chemical intermediate. In addition to being primarily used in the production of MDI and HMDI, it is also extensively used in the preparation of polyimide (PI) insulating varnishes, polyesterimide (PEI) insulating varnishes, bismaleimide resins, and other electrical insulation materials. It can also be used as a curing agent for epoxy resins and as a chain extender for polyurethane elastomers.Mixing ratio: YLE-128 (E-51) epoxy resin : liquid DDM = 100 g : 30–35 g (flexible)Curing conditions: 80 °C / 3–4 hours