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CAS 61788-44-1

  • YOLATECH DMP-30
    YOLATECH DMP-30
    May 14, 2026
    Yolatech Company DMP-30 Equivalent Grades: K54, KH-30, HI-54K, HY960.   Yolatech DMP-30 consists of 2,4,6-Tris(dimethylaminomethyl)phenol. It is a versatile curing accelerator designed to shorten the curing time of epoxy resin systems. It exhibits excellent compatibility with Polyamine and Polyamide series epoxy curing agents. It is soluble in alcohol, benzene, acetone, and cold water, and slightly soluble in hot water.   Physical Properties Chemical Name: 2,4,6-Tris(dimethylaminomethyl)phenol Synonyms: DMP-30 / K-54 / Accelerator Catalyst HI-54K Molecular Formula: C₁₅H₂₇N₃O Molecular Weight: 265.4 CAS Number: 90-72-2 EINECS Number: 202-013-9 Appearance: Transparent light yellow liquid Color: Max 6 (Gardner) Amine Value: 580-630 mgKOH/g Viscosity (25°C): 100-300 cps (Brookfield) Moisture Content: Max 0.5% Refractive Index (20°C): 1.5150-1.5200 Specific Gravity (25°C): 0.97-0.99 Flash Point: 150°C     Applications DMP-30 serves as a curing accelerator in solvent-based or solvent-free epoxy systems, including: Polyamine series curing systems. Polyamide and Amidoamine series epoxy curing systems. Mercaptan (Thiol) series epoxy curing systems. Carboxylic Acid Anhydride or Polysulfide series epoxy curing systems. It is widely used in coatings, adhesives, and flooring industries. It acts as a catalyst for epoxy automotive body adhesives, epoxy-anhydride systems, and as a solid catalyst for isocyanates and polyols.     Mechanism of Action The reaction between epoxy resin (containing epoxy groups) and amine curing agents (such as aliphatic amines and polyamides) is a nucleophilic ring-opening reaction: the amine group (-NH₂) attacks the ring of the epoxy group, opening the ring to form hydroxyl groups (-OH), which then undergo further crosslinking.However, this reaction is slow at room temperature (especially in low-temperature environments). DMP-30's phenolic hydroxyl group activates the epoxy group via hydrogen bonding, while the dimethylamino group (-N(CH₃)₂) acts as a nucleophile to promote the combination of the amine and epoxy groups. This significantly lowers the activation energy, shortening the curing time by 30%-50% (e.g., at 25°C, curing takes 24 hours without accelerator, but only 8-12 hours with DMP-30).   Recommended Dosage 1. As Epoxy Curing Agent: When used alone, the dosage for YLE-128 epoxy resin (Epoxy Equivalent Weight 185-195) is approximately 10%. It enables rapid curing at room temperature or low temperatures for coatings, castings, and sealants. For YLE-220 epoxy resin, the dosage is approximately 12.5%. For Epoxy-Liquid Polysulfide systems, the dosage is 10-15% for room temperature curing and 6% for heat curing. It imparts unique bonding, casting, and sealing properties. Typical range: 5-15 PHR. 2. As Epoxy Accelerator: When mixed with other epoxy curing agents, it acts as an accelerator to increase curing rates. Dosage is 0.1%-3% PHR of the main curing agent. Widely used in anti-corrosion coatings, cast floor concrete protection, and adhesives. 3. As Polyurethane Catalyst: It is a catalyst for isocyanate trimerization. It has higher catalytic selectivity for Polyisocyanurate (PIR) reactions compared to PUR, making it suitable for PIR formulations. DMP-30 is a milder activity catalyst; it requires a larger dosage in formulations, resulting in a gentle reaction, stable rise, good flowability, and end products with PIR high-temperature and flame-retardant effects.     Advantages Highly efficient acceleration (strong low-temperature applicability). Improves coating film hardness and chemical resistance. Good compatibility with most epoxy resins and curing agents (no phase separation).     Limitations May experience slight yellowing upon long-term UV exposure (due to phenolic hydroxyl oxidation), making it unsuitable for outdoor high-gloss flooring. Irritating to skin; potential for trace formaldehyde release. Protective equipment must be worn during application.     Storage & Handling Avoid excessive heat and humidity. Store in unopened original containers at room temperature, away from fire sources, strong acids, strong bases, and strong oxidizing agents. Shelf life is 12 months from the date of production. Precautions: Please refer to the Yolatech Product DMP-30 Material Safety Data Sheet (MSDS). Packaging: 200Kg drum, 1000 IBC.  
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  • Epoxy Resin Modifier: Styrenated Phenol MSP-250
    Epoxy Resin Modifier: Styrenated Phenol MSP-250
    May 09, 2026
    Nonylphenol has long been used in epoxy resin systems as a functional aid to promote dilution. However, in recent years, with increasing health awareness and stricter environmental regulations, the use of nonylphenol has become increasingly restricted. Nanjing Youlai's Styrenated Phenol MSP-250 serves as an epoxy resin modifier. In addition to its ideal chemical properties, it meets the demands of environmental regulations.   Typical Data Product Name: Styrenated Phenol Grade: MSP-250 Appearance: Liquid Color (APHA): <200 Viscosity (cps/25°C): 300~800 Hydroxyl Value (mg KOH/g): 230~260   Performance Features As an epoxy resin modifier, MSP-250 is a clear, low-viscosity liquid. When added to the curing agent component, it accelerates the curing speed and improves the water resistance, anti-whitening properties, scratch resistance, abrasion resistance, hardness, and leveling performance of the cured product. MSP-250 exhibits color stability under both long-term and high-temperature conditions. Comparison of color performance between MSP-250 and Nonylphenol when mixed with curing agents:   Within 1 week at room temperature: No significant difference observed. Within 3 days at 60°C: MSP-250 demonstrates superior color stability compared to Nonylphenol. Within 1 week at 60°C: MSP-250 demonstrates superior color stability compared to Nonylphenol.   Application Area Epoxy Coatings & Heavy-duty Anti-corrosion Coatings: Acts as a plasticizer, diluent, and accelerator. Craft & Jewelry Adhesives: Offers excellent transparency, abrasion resistance, and adhesion. Electronics & Electrical: Suitable for potting, varnishes, industrial adhesives, and LED encapsulation. Automotive Sealants: Improves bonding for doors and headliners, providing waterproofing and rust prevention for internal and external panels. Civil Engineering & Construction: Applicable for crack sealing, crack injection, carbon fiber reinforcement, and steel reinforcement.
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