Dicyandiamide curing agent belongs to the heating curing class of latent curing agent, solid at room temperature, insoluble in epoxy resin, dispersed in epoxy resin in the form of microparticles, through the heating reaction, once heated to the melting point of the vicinity of the start of the dissolution and rapid reaction curing.

Curing reaction of dicyandiamide

The molecular structure of dicyandiamide contains a cyano group (-CN) in addition to four active hydrogens. Cyano group can also participate in the curing reaction as a functional group.

The curing reaction temperature of dicyandiamide is generally in the range of 160~180°C, and the curing reaction time is 20~60 minutes. For bisphenol A epoxy resin with 190 epoxy equivalents, the theoretical dosage of dicyandiamide curing agent (calculated on the basis of active hydrogen equivalents) is 11.1 parts, but the actual dosage is often in the range of 4-10 parts (based on 100 parts of the resin by mass).

Dicyandiamide micropowder is dispersed into the epoxy resin, has a suitable storage period, is stable in storage, does not delaminate, and does not cure.

The fineness of the dicyandiamide particles may vary from product to product. The finer the dicyandiamide particles, the more obvious the performance advantage for curing reaction

1. Ultra-fine dicyandiamide particles are easier to be evenly dispersed into the epoxy resin liquid.
2. Ultra-fine dicyandiamide particles can be better mixed and dissolved in the epoxy resin liquid than ordinary dicyandiamide.

Application areas of dicyandiamide curing compounds

Dicyandiamide epoxy resin has good adhesive property, heat resistance and stable storage period. Dicyandiamide epoxy resins can be widely used in powder coatings, carbon fibre prepregs, heat curable inks, laminates, single component adhesives and other applications.

Typical applications:

1. Preparation of prepregs for the manufacture of reinforced composites (wind energy, automotive, aerospace, marine engineering and other industries).
2. Electronic packaging materials, adhesives.
3. Powder coatings (especially heavy duty anti-corrosion function).
4. For epoxy-based adhesives (reinforced materials).

Nanjing Yolatech provides all kinds of high purity and low chlorine epoxy resins, including Bisphenol A epoxy resin, Bisphenol F epoxy resin, Phenolic epoxy resin, Brominated epoxy resin, DOPO modified phenolic epoxy resin, MDI modified epoxy resin, DCPD epoxy resin, Multifunctional epoxy resin, Crystalline epoxy resin, HBPA epoxy resin and so on. And we also could provide all kinds of curing agents or hardeners and diluents.

We will be at your service 24 hours a day. Pls contact us freely.